| Micro- and Opto-Electronic Materials and Structures |
| | >>Link: Materials Physics\Materials Physics |
| | Carbon Nanotube Based Interconnect Technology |
| | >>Link: Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges\Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges |
| | Thin Films for Microelectronics and Photonics |
| | >>Note: Physics, Mechanics, Characterization, and Reliability |
| | >>Link: Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability\Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability |
| | Photorefractive Materials and Devices |
| | >>Link: Photorefractive Materials and Devices for Passive Components in WDM Systems\Photorefractive Materials and Devices for Passive Components in WDM Systems |
| | Thermo-Optic Effects in Polymer Bragg Gratings |
| | >>Link: Thermo-Optic Effects in Polymer Bragg Gratings\Thermo-Optic Effects in Polymer Bragg Gratings |
| | Virtual Thermo-Mechanical Prototyping |
| | >>Link: Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems\Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems |
| | Determine the Temperature Profile |
| | Polymer Materials Characterization |
| | >>Link: Polymer Materials Characterization, Modeling and Application\Polymer Materials Characterization, Modeling and Application |
| | >>Link: Nomenclature\Nomenclature |
| | >>Link: Materials Mechanics\Materials Mechanics |
| | >>Link: Physical Design\Physical Design |
| | Reliability and Packaging |
| | >>Link: Reliability and Packaging\Reliability and Packaging |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | >>Link: Page-1\Micro- and Opto-Electronic Materials and Structures\Reliability and Packaging |
| | Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices |
| | >>Link: Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices\Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices |
| | Micro-Deformation Analysis and Reliability Estimation of Micro-Components by eans of NanoDAC Technique |
| | >>Link: Micro-Deformation Analysis and Reliability Estimation of Micro-Components by eans of NanoDAC Technique\Micro-Deformation Analysis and Reliability Estimation of Micro-Components by eans of NanoDAC Technique |
| | Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Microand Opto-Electronic Materials |
| | >>Link: Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Microand Opto-Electronic Materials\Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Microand Opto-Electronic Materials |
| | The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging |
| | >>Link: The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging\The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging |
| | Recent Advances of Conductive Adhesives |
| | >>Note: A Lead-Free Alternative in Electronic Packaging |
| | >>Link: Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging\Recent Advances of Conductive Adhesives |
| | MEMS Packaging and Reliability |
| | Flip-Chip Assembly for Hybrid Integration |
| | Soldered Assembly for Three-Dimensional MEMS |
| | Flexible Circuit Boards for MEMS |
| | Atomic Layer Deposition for Reliable MEMS |
| | Durability of Optical Nanostructures |
| | >>Note: Laser Diode Structures and Packages, A Case Study |
| | High Efficiency Quantum Confined (Nanostructured) III-Nitride Based Light Emitting Diodes And Lasers |
| | Investigation of Reliability Issues in High Power Laser Diode Bar Packages |
| | Preparation of Packaged Samples for Reliability Testing |
| | Finding and Model of Reliability Results |
| | Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board |
| | >>Link: Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board\Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board |
| | Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics |
| | >>Link: Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics\Adhesives for Micro- and Opto-Electronics Application |
| | Interconnect Reliability Considerations in Portable Consumer Electronic Products |
| | >>Link: Interconnect Reliability Considerations in Portable Consumer Electronic Products\Interconnect Reliability Considerations in Portable Consumer Electronic Products |
| | Adhesive Bonding of Passive Optical Components |
| | >>Link: Adhesive Bonding of Passive Optical Components\Adhesive Bonding of Passive Optical Components |
| | Fundamentals of Reliability and Stress Testing |
| | >>Link: Fundamentals of Reliability and Stress Testing\Fundamentals of Reliability and Stress Testing |
| | Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications |
| | >>Link: Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications\Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications |
| | Electrically Conductive Adhesives: A Research Status Review |
| | >>Link: Electrically Conductive Adhesives: A Research Status Review\Electrically Conductive Adhesives |
| | Die Attach Quality Testing by Structure Function Evaluation |
| | >>Link: Die Attach Quality Testing by Structure Function Evaluation\Die Attach Quality Testing by Structure Function Evaluation |
| | How to Make a Device into a Product: |
| | >>Link: How to Make a Device into a Product: \How to Make a Device into a Product: |
| | Electrically Conductive Adhesives |
| | >>Link: Electrically Conductive Adhesives\Electrically Conductive Adhesives |
| | Mechanical Behavior of Flip Chip Packages under Thermal Loading |
| | >>Link: Mechanical Behavior of Flip Chip Packages under Thermal Loading\Mechanical Behavior of Flip Chip Packages under Thermal Loading |
| | Advances in Optoelectronic Methodology for MOEMS Testing |
| | Optoelectronic Methodology |
| | Representative Applications |
| | Conclusions and Recommendations |
| | How to Make a Device into a Product: |
| | >>Note: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests |
| | >>Link: Reliability and Packaging\Reliability and Packaging\How to Make a Device into a Product: |
| | ALTs: Pitfalls and Challenges |
| | Reliability, Cost and Time-to-Market |
| | Reliability is a Complex Property |
| | Ways to Prevent and Accommodate Failures |
| | Accelerated Life Tests (ALTs) |
| | Accelerated Test Conditions |
| | Accelerated Stress Categories |
| | Reliability Should Be Taken Care of on a Permanent Basis |
| | Three Major Classes of Engineering Products and Market Demands |
| | Accelerated Life Tests (ALTs) and Highly Accelerated Life Tests (HALTs) |
| | Failure Mechanisms and Accelerated Stresses |
| | Non-Destructive Evaluations (NDE’s) |
| | Some Accelerated Life Test (ALT) Models |
| | Boltzmann-Arrhenius Equation |
| | Coffin-Manson Equation (Inverse Power Law) |
| | Fatigue Damage Model (Miner’s Rule) |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Fundamentals of Reliability and Stress Testing |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Fundamentals of Reliability and Stress Testing |
| | More Performance at Lower Cost in Shorter Time-to-market |
| | Rapid Technological Developments |
| | Integration of More Products into Human Life |
| | Diverse Environmental Stresses |
| | Reliability Programs and Strategies |
| | Failure Mechanisms in Electronics and Packaging |
| | Failure Mechanisms at Chip Level Include |
| | Failure Mechanisms at Bonding Include |
| | Failure Mechanisms in Device Packages Include |
| | Failure Mechanisms in Epoxy Compounds Include |
| | Failure Mechanisms at Shelf Level Include |
| | Failure Mechanisms in Material Handling Include |
| | Failure Mechanisms in Fiber Optics Include |
| | Failure Mechanisms in Flat Panel Displays Include |
| | Product Weaknesses and Stress Testing |
| | Stress Testing Formulation |
| | Threshold and Cumulative Stress Failures |
| | Lifetime Failure Fraction |
| | Robustness Against Maximum Service Life Stress |
| | Systems with Multiple Independent Failure Modes |
| | Failure Rate Distribution |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Electrically Conductive Adhesives |
| | >>Note: A Research Status Review |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Electrically Conductive Adhesives: A Research Status Review |
| | Maximum Current Carrying Capacity |
| | Isotropic Conductive Adhesives (ICAs) |
| | Anisotropic Conductive Adhesives (ACAs) |
| | Non-Conductive Adhesive (NCA) |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices |
| | Intrinsic Stress Due to Semiconductor Wafer Processing |
| | Intrinsic Stress in Processed Wafer: Summary |
| | Die Stress Result from Flip-chip Assembly |
| | Consistent Composite Plate Model |
| | Bimaterial Plate (BMP) Case |
| | Validation of the Bimaterial Model |
| | Die Stress in Flip Chip Assembly: Summary |
| | Thermal Stress Due to Temperature Cycling |
| | Constitutive Equation for Solder |
| | Time-Dependent Thermal Stresses of Solder Joint |
| | Solder Joint Reliability Estimation |
| | Thermal Stress Due to Temperature Cycling: Summary |
| | Residual Stress in Polymer-based Low Dielectric Constant (low-k) Materials |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Micro-Deformation Analysis and Reliability Estimation of Micro-Components by eans of NanoDAC Technique |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Micro-Deformation Analysis and Reliability Estimation of Micro-Components by eans of NanoDAC Technique |
| | Basics of Digital Image Correlation |
| | Cross Correlation Algorithms on Gray Scale Images |
| | Subpixel Analysis for Enhanced Resolution |
| | Results of Digital Image Correlation |
| | Displacement and Strain Measurements on SFM Images |
| | Digital Image Correlation under SPM Conditions |
| | Technical Requirements for the Application of the Correlation Technique |
| | Deformation Analysis on Thermally and Mechanically Loaded Objects under the SFM |
| | Reliability Aspects of Sensors and Micro Electro-Mechanical Systems (MEMS) |
| | Thermally Loaded Gas Sensor under SFM |
| | Crack Detection and Evaluation by SFM |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Recent Advances of Conductive Adhesives |
| | >>Note: A Lead-Free Alternative in Electronic Packaging |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Recent Advances of Conductive Adhesives |
| | Isotropic Conductive Adhesives (ICAs) |
| | Improvement of Electrical Conductivity of ICAs |
| | Stabilization of Contact Resistance on Non-Noble Metal Finishes |
| | Silver Migration Control of ICA |
| | Improvement of Reliability in Thermal Shock Environment |
| | Improvement of Impact Performance of ICA |
| | Anisotropic Conductive Adhesives (ACAs)/Anisotropic Conductive Film (ACF) |
| | Application of ACA/ACF in Flip Chip |
| | Improvement of Electrical Properties of ACAs |
| | Thermal Conductivity of ACA |
| | Electrical Characteristics |
| | High Frequency Compatibility |
| | ECAs with Nano-filler for Wafer Level Application |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Interconnect Reliability Considerations in Portable Consumer Electronic Products |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Interconnect Reliability Considerations in Portable Consumer Electronic Products |
| | Reliability-Thermal, Mechanical and Electrochemical |
| | Electrochemical Environment |
| | Reliability Comparisons in Literature |
| | Thermomechanical Reliability |
| | Influence of Material Properties on Reliability |
| | Electrochemical Environment |
| | Reliability test Practices |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Adhesives for Micro- and Opto-Electronics Application |
| | >>Note: Chemistry, Reliability and Mechanics |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics |
| | Use of Adhesives in Micro and Opto-Electronic Assemblies |
| | General Properties of Adhesives |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Adhesive Bonding of Passive Optical Components |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Adhesive Bonding of Passive Optical Components |
| | Optical Devices and Assemblies |
| | Opto-electronics Assemblies: Specific Requirements |
| | Adhesive Bonding in Optical Assemblies |
| | Adhesive Selection and Dispensing |
| | Planar Lightwave Circuit (PLC) Pigtailing |
| | Summary and Recommendations |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging |
| | >>Link: Reliability and Packaging\Reliability and Packaging\The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging |
| | Moisture Transport Behavior |
| | Underfill Moisture Absorption Characteristics |
| | Moisture Absorption Modeling |
| | Elastic Modulus Variation Due to Moisture Absorption |
| | Effect of Moisture Preconditioning |
| | Elastic Modulus Recovery from Moisture Uptake |
| | Effect of Moisture on Interfacial Adhesion |
| | Interfacial Fracture Testing |
| | Effect of Moisture Preconditioning on Adhesion |
| | Interfacial Fracture Toughness Recovery from Moisture Uptake |
| | Interfacial Fracture Toughness Moisture Degradation Model |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Microand Opto-Electronic Materials |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Microand Opto-Electronic Materials |
| | Multi-Stage Peel Test (MPT) |
| | Energy Variation in Steady State Peeling |
| | Interfacial Adhesion Strength of Copper Thin Film |
| | Measurement of Adhesion Strength by the MPT |
| | UV-Irradiation Effect on Ceramic/Polymer Interfacial Strength |
| | Preparation of PET/ITO Specimen |
| | Measurement of Interfacial Strength by MPT |
| | Surface Crack Formation on ITO Layer under Tensile Loading |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Electrically Conductive Adhesives |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Electrically Conductive Adhesives |
| | Introduction and Historical Background |
| | Percolation and Critical Filler Content |
| | Aging Behavior and Quality Assessment |
| | Material Selection and Experimental Parameters |
| | Curing Parameters and Definition of Curing Time |
| | Testing Conditions, Typical Results, and Conclusions |
| | About Typical Applications |
| | ICA for Attachment of Power Devices |
| | ICA for Interconnecting Parts with Dissimilar Thermal Expansion Coefficient |
| | ICA for Cost-Effective Assembling of Multichip Modules |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Die Attach Quality Testing by Structure Function Evaluation |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Die Attach Quality Testing by Structure Function Evaluation |
| | Detecting Voids in the Die Attach of Single Die Packages |
| | Simulation Experiments for Locating the Die Attach Failure on Stacked Die Packages |
| | Simulation Tests Considering Stacked Dies of the Same Size |
| | Simulation Experiments on a Pyramidal Structure |
| | Verification of the Methodology by Measurements |
| | Comparison of the Transient Behavior of Stacked Die Packages Containing Test Dies, Prior Subjected to Accelerated Moisture and Temperature Testing |
| | Comparison of the Transient Behavior of Stacked Die Packages Containing Real Functional Dies, Subjected Prior to Accelerated Moisture and Temperature Testing |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Mechanical Behavior of Flip Chip Packages under Thermal Loading |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Mechanical Behavior of Flip Chip Packages under Thermal Loading |
| | Phase Shifted Shadow Moire Method |
| | Electronic Speckle Pattern Interferometry (ESPI) Method |
| | Substrate CTE Measurement |
| | Behavior of Flip Chip Packages under Thermal Loading |
| | Warpage at Room Temperature |
| | Warpage at Elevated Temperatures |
| | Effect of Underfill on Warpage |
| | Finite Element Analysis of Flip Chip Packages under Thermal Loading |
| | Parametric Study of Warpage for Flip Chip Packages |
| | Change of the Chip Thickness |
| | Change of the Substrate Thickness |
| | Change of the Young’s Modulus of the Underfill |
| | Change of the CTE of the Underfill |
| | Effect of the Geometry of the Underfill Fillet |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications |
| | Effect of the Interfacial Compliance on the interfacial Shearing Stress |
| | Internal Compressive Forces |
| | Advanced Nano-Particle Material (NPM) |
| | Highly-Compliant Nano-Systems |
| | Bimaterial Assembly Subjected to an External Shearing Load and Change in Temperature: Expected Stress Relief due to the Elevated Interfacial Compliance |
| | Cantilever Wire (“Beam”) Subjected at its Free End to a Lateral (Bending) and an Axial (Compressive) Force |
| | Compressive Forces in the NPM-Based Compound Structure |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board |
| | >>Link: Reliability and Packaging\Reliability and Packaging\Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board |
| | Background to Optical Interconnects |
| | Transmission Equipment for Optical Interconnects |
| | Very Short Reach Optical Interconnects |
| | Free Space USR Optical Interconnects |
| | Guided Wave USR Interconnects |
| | Component Assembly of OECB’s |
| | Computational Modeling of Optical Interconnects |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Reliability and Packaging |
| | >>Link: Page-1\Micro- and Opto-Electronic Materials and Structures\Materials Mechanics |
| | Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension |
| | Fiber Optics Structural Mechanics |
| | New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Applications |
| | New Nano-Particle Material (NPM) |
| | NPM-Based Optical Silica Fibers |
| | Area Array Technology for High Reliability Applications |
| | >>Link: Area Array Technology for High Reliability Applications\Area Array Technology for High Reliability Applications |
| | Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections |
| | >>Link: Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections\Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections |
| | Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections |
| | >>Link: Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections\Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections |
| | Fatigue Life Assessment for Lead-Free Solder Joints |
| | The Intermetallic Compound Formed at the Interface of the Solder Joints and the Cu-pad |
| | Mechanical Fatigue Testing Equipment and Load Condition in the Lead Free Solder |
| | Results of Mechanical Fatigue Test |
| | Critical Fatigue Stress Limit for the Intermetallic Compound Layer |
| | Influence of the Plating Material on the Fatigue Life of Sn-Zn (Sn-9Zn and Sn-8Zn-3Bi) Solder Joints |
| | Lead-Free Solder Materials |
| | >>Note: Design For Reliability |
| | >>Link: Lead-Free Solder Materials: Design For Reliability\Lead-Free Solder Materials: Design For Reliability |
| | Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures |
| | >>Link: Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures\Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures |
| | Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods |
| | >>Link: Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods\Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods |
| | Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach |
| | >>Link: Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach\Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach |
| | Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension |
| | Extension: Quality of Shock Protection with a Flexible Wire Elements |
| | Pre-Buckling Mode: Small Displacements |
| | Post-Buckling Mode: Large Displacements |
| | Dynamic Physical Reliability in Application to Photonic Materials |
| | >>Link: Dynamic Physical Reliability in Application to Photonic Materials\Dynamic Physical Reliability in Application to Photonic Materials |
| | High-Speed Tensile Testing of Optical Fibers-New Understanding for Reliability Prediction |
| | >>Link: High-Speed Tensile Testing of Optical Fibers-New Understanding for Reliability Prediction\High-Speed Tensile Testing of Optical Fibers-New Understanding for Reliability Prediction |
| | The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior |
| | >>Link: The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior\The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior |
| | High-Speed Tensile Testing of Optical Fibers-New Understanding for Reliability Prediction |
| | >>Link: Materials Mechanics\Materials Mechanics\High-Speed Tensile Testing of Optical Fibers-New Understanding for Reliability Prediction |
| | Single-Region Power-Law Model |
| | Two-Region Power-Law Model |
| | Universal Static and Dynamic Fatigue Curves |
| | Influence of Multiregion Model on Lifetime Prediction |
| | High Speed Axial Strength Testing: Measurement Limits |
| | Incorporating Static Fatigue Results into Dynamic Fatigue Curves |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach |
| | >>Link: Materials Mechanics\Materials Mechanics\Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach |
| | Heat Transfer and Moisture Diffusion in IC Packages |
| | Fundamentals of Interfacial Fracture Mechanics |
| | Criterion for Crack Propagation |
| | Interface Fracture Toughness |
| | Total Stress Intensity Factor |
| | Calculation of SERR and Mode Mixity |
| | Crack Surface Displacement Extrapolation Method |
| | Modified J -integral Method |
| | Modified Virtual Crack Closure Method |
| | Variable Order Boundary Element Method |
| | Interaction Integral Method |
| | Experimental Verification |
| | Delamination Along Pad-Encapsulant Interface |
| | Delamination Along Die-Attach/Pad Interface |
| | Analysis Using Variable Order Boundary Element Method |
| | Discussion of the Various Numerical Methods for Calculating G and y |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Area Array Technology for High Reliability Applications |
| | >>Link: Materials Mechanics\Materials Mechanics\Area Array Technology for High Reliability Applications |
| | Area Array Packages (AAPs) |
| | Advantages of Area Array Packages |
| | Disadvantages of Area Arrays |
| | Chip Scale Packages (CSPs) |
| | Plastic Area Array Packages |
| | Plastic Package Assembly Reliability |
| | Reliability Data for BGA, Flip Chip BGA, and CSP |
| | Ceramic Package Assembly Reliability |
| | Literature Survey on CBGA/CCGA Assembly Reliability |
| | Comparison of 560 I/O PBGA and CCGA assembly reliability |
| | Designed Experiment for Assembly |
| | List of Acronyms and Symbols |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections |
| | >>Link: Materials Mechanics\Materials Mechanics\Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections |
| | Physical Metallurgy of Lead-Free Solder Alloys |
| | Interfacial Reaction: Wetting and Spreading |
| | Interfacial Intermetallic Formation and Growth at Liquid-Solid Interfaces |
| | Lead-Free Soldering Processes and Compatibility |
| | Lead-Free Soldering Materials |
| | PCB Substrates and Metalization Finishes |
| | Lead-Free Soldering Processes |
| | Components for Lead-Free Soldering |
| | Design, Equipment and Cost Considerations |
| | Reliability of Pb-Free Solder Interconnects |
| | Reliability and Failure Distribution of Pb-Free Solder Joints |
| | Effects of Loading and Thermal Conditions on Reliability of Solder Interconnection |
| | Reliability of Pb-Free Solder Joints in Comparison to Sn-Pb Eutectic Solder Joints |
| | Guidelines for Pb-free Soldering and Improvement in Reliability |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods |
| | >>Link: Materials Mechanics\Materials Mechanics\Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods |
| | Extension: Microscopic Moire Interferometry |
| | Thermal Deformation Measured at Room Temperature |
| | Deformation as a Function of Temperature |
| | Twyman/Green Interferometry |
| | Far Infrared Fizeau Interferometry |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections |
| | >>Link: Materials Mechanics\Materials Mechanics\Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections |
| | The Four Steps of The Iterative Approach |
| | The Role of Different Simulation Tools in Reliability Engineering |
| | Interconnection Microstructures and Their Evolution |
| | Solidification Structure and the Effect of Contact Metalization Dissolution |
| | Interfacial Reactions Products |
| | Deformation Structures (Due to Slip and Twinning) |
| | Recovery, Recrystallization and Grain Growth |
| | Two Case Studies on Reliability Testing |
| | Case 1: Reliability of Lead-Free CSPs in Thermal cycling |
| | Case 2: Reliability of Lead-Free CSPs in Drop Testing |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Dynamic Physical Reliability in Application to Photonic Materials |
| | >>Link: Materials Mechanics\Materials Mechanics\Dynamic Physical Reliability in Application to Photonic Materials |
| | Introduction: Dynamic Reliability Approach to the Evolution of Silica Fiber Performance |
| | Dynamic Physical Model of Damage Accumulation |
| | Impact of the Three-DimensionalMechanical-Temperature-Humidity Load on the Optical Fiber Reliability |
| | Effect of Bimodality and Its Explanation Based on the Suggested Model |
| | Reliability Improvement through NPM-Based Fiber Structures |
| | Environmental Protection by NPM-Based Coating and Overall Self-Curing Effect of NPM Layers |
| | Improvement in the Reliability Characteristics by Employing NPM Structures in Optical Fibers |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior |
| | >>Link: Materials Mechanics\Materials Mechanics\The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior |
| | Background on Nonlinear Dynamics and Nonlinear Thermo-Elasticity Theories |
| | Nonlinear Thermo-Elasticity Development for an Isotropic Laminate Subject to Thermal and Mechanical and Load |
| | Thin Laminate Deflection Response Subject to Thermal Effect and Mechanical Load |
| | Steady State Temperature Effect |
| | Transient Thermal Field Effect |
| | Stress Field in Nonlinear Dynamics Response |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Lead-Free Solder Materials: Design For Reliability |
| | >>Link: Materials Mechanics\Materials Mechanics\Lead-Free Solder Materials |
| | Mechanics of Solder Materials |
| | Fatigue Behavior of Solder Materials |
| | Design For Reliability (DFR) |
| | Constitutive Models For Lead Free Solders |
| | FEA Modeling and Simulation |
| | Reliability Test and Analysis |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures |
| | >>Link: Materials Mechanics\Materials Mechanics\Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures |
| | Optical Method and Recording of Fringe Patterns |
| | Fractional Fringe Approach |
| | Grating Frequency Increase |
| | Creation of a High-Frequency Master Grating |
| | Combination of the High Grating Frequency and Fractional Fringe Approach |
| | Test Boards and Specimen Grating |
| | Elevated Temperature Test |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | >>Link: Page-1\Micro- and Opto-Electronic Materials and Structures\Nomenclature |
| | Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems |
| | Effect of Physical Nonlinearity on Vibrations of Piezoelectric Rods Driven by Alternating Electric Field |
| | Physically Nonlinear Constitutive Relationships for an Orthotropic Cylindrical Piezoelectric Rod Subject to an Electric Field in the Axial Direction |
| | Analysis of Uncoupled Axial Vibrations |
| | Solution for Coupled Axial-Radial Axisymmetric Vibrations by the Generalized Galerkin Procedure |
| | Numerical Results and Discussion |
| | The Effect of the Nonlinear Stress-Strain Relationship on the Response of Optical Fibers |
| | Stability of Optical Fibers |
| | Stresses and Strains in a Lightwave Coupler Subjected to Tension |
| | Bending of an Optical Fiber |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | >>Link: Page-1\Micro- and Opto-Electronic Materials and Structures\Materials Physics |
| | Polymer Materials Characterization, Modeling and Application |
| | >>Link: Polymer Materials Characterization, Modeling and Application\Polymer Materials Characterization, Modeling and Application |
| | Thermo-Optic Effects in Polymer Bragg Gratings |
| | >>Link: Thermo-Optic Effects in Polymer Bragg Gratings\Thermo-Optic Effects in Polymer Bragg Gratings |
| | Solution Procedure to Obtain the Optical Power Along the PFBG |
| | Solution Procedure to Determine the Temperature Profile Along the PFBG |
| | Solution Procedure of the Temperature Profile Along the PFBG with the LED |
| | Solution Procedure of the Temperature Profile Along the PFBG with the SM LD |
| | Photorefractive Materials and Devices for Passive Components in WDM Systems |
| | >>Link: Photorefractive Materials and Devices for Passive Components in WDM Systems\Photorefractive Materials and Devices for Passive Components in WDM Systems |
| | Thin Films for Microelectronics and Photonics |
| | >>Note: Physics, Mechanics, Characterization, and Reliability |
| | >>Link: Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability\Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability |
| | Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges |
| | >>Link: Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges\Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges |
| | Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems |
| | >>Link: Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems\Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Polymer Materials Characterization, Modeling and Application |
| | >>Link: Materials Physics\Materials Physics\Polymer Materials Characterization, Modeling and Application |
| | Polymers in Microelectronics |
| | Basics of Visco-Elastic Modeling |
| | Preliminary: State Dependent Viscoelasticity |
| | Linear State Dependent Viscoelasticity |
| | Isotropic Material Behavior |
| | Interrelations between Property Functions |
| | Linear Visco-Elastic Modeling (Fully Cured Polymers) |
| | Static Testing of Relaxation Moduli |
| | Time-Temperature Superposition Principle |
| | Static Testing of Creep Compliances |
| | Modeling of Curing Polymers |
| | “Partly State Dependent” Modeling (Curing Polymers) |
| | “Fully State Dependent” Modeling (Curing Polymers) |
| | Parameterized Polymer Modeling (PPM) |
| | Experimental Characterizations |
| | PPM Modeling in Virtual Prototyping |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Thermo-Optic Effects in Polymer Bragg Gratings |
| | >>Link: Materials Physics\Materials Physics\Thermo-Optic Effects in Polymer Bragg Gratings |
| | Fundamentals of Bragg Gratings |
| | Thermo-Optical Modeling of Polymer Fiber Bragg Grating |
| | Heat Generation by Intrinsic Absorption |
| | Analytical Thermal Model of PFBG |
| | FEA Thermal Model of PFBG |
| | Thermo-Optical Model of PFBG |
| | Thermo-Optical Behavior of PMMA-Based PFBG |
| | Description of a PMMA-Based PFBG and Light Sources |
| | Power Variation Along the PFBG |
| | Thermo-Optical Behavior of the PFBG-LED Illumination |
| | Thermo-Optical Behavior of the PFBG-SM LD Illumination |
| | Thermo-Optical Behavior of the PFBG Associated with Other Light Sources |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Photorefractive Materials and Devices for Passive Components in WDM Systems |
| | >>Link: Materials Physics\Materials Physics\Photorefractive Materials and Devices for Passive Components in WDM Systems |
| | Tunable Flat-Topped Filter |
| | Design for Implementation |
| | Wavelength Selective 2x2 Switch |
| | Experimental Demonstration |
| | High Performance Dispersion Compensators |
| | Multi-Channel Dispersion-Slope Compensator |
| | High Precision FBG Fabrication Method and Dispersion Management Filters |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges |
| | >>Link: Materials Physics\Materials Physics\Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges |
| | Introduction: Physical Characteristics of Carbon Nanotubes |
| | CNT Fabrication Technologies |
| | Chemical Vapor Deposition of Carbon Nanotubes |
| | Process Integration and Development |
| | Carbon Nanotubes as Interconnects |
| | Limitations of the Current Technology |
| | Architecture, Geometry and Performance Potential Using Carbon Nanotubes |
| | Design, Manufacture and Reliability |
| | Microstructural Attributes and Effects on Electrical Characteristics |
| | Interfacial Contact Materials |
| | End-contacted Metal-CNT Junction |
| | Thermal Stress Characteristics |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems |
| | >>Link: Materials Physics\Materials Physics\Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems |
| | Physical Aspects for Numerical Simulations |
| | Material Properties and Models |
| | Thermo-Mechanical Related Failures |
| | Designing for Reliability |
| | Mathematical Aspects of Optimization |
| | Response Surface Modeling |
| | Advanced Approach to Virtual Prototyping |
| | Numerical Approach to QFN Package Design |
| | Conclusion and Challenges |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability |
| | >>Link: Materials Physics\Materials Physics\Thin Films for Microelectronics and Photonics |
| | Thin Film Structures and Materials |
| | Organic and Polymer Films |
| | Intermediate Layers: Adhesion, Barrier, Buffer, and Seed Layers |
| | Properties of Specific Materials |
| | Manufacturability/Reliability Challenges |
| | Film Deposition and Stress |
| | Grain Structure and Texture |
| | Electromigration and Voiding |
| | Structural Considerations |
| | Need for Mechanical Characterization |
| | Methods for mechanical characterization of thin films |
| | Grain Size and Structure Size Effects |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | >>Link: Page-1\Micro- and Opto-Electronic Materials and Structures\Physical Design |
| | Analytical Thermal StressModeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems |
| | >>Note: Role, Attributes, Challenges, Results |
| | Thermal Loading and Thermal Stress Failures 3 |
| | Thermal Stress Modeling 4 |
| | Bi-Metal Thermostats and other Bi-Material Assemblies 5 |
| | Finite-Element Analysis 5 |
| | Die-Substrate and other Bi-Material Assemblies 6 |
| | “Global” and “Local” Mismatch and Assemblies Bonded at the Ends |
| | Assemblies with Low Modulus Adhesive Layer at the Ends |
| | Termally Matched Assemblies |
| | Polymeric Materials And Plastic Packages |
| | Thermal Stress Induced Bowing and Bow-Free Assemblies |
| | Optical Fibers and other Photonic Structures |
| | The Wirebonded Interconnect: A Mainstay for Electronics |
| | >>Link: The Wirebonded Interconnect: A Mainstay for Electronics\The Wirebonded Interconnect: A Mainstay for Electronics |
| | Probabilistic Physical Design of Fiber-Optic Structures |
| | >>Link: Probabilistic Physical Design of Fiber-Optic Structures\Probabilistic Physical Design of Fiber-Optic Structures |
| | Metallurgical Interconnections for Extreme High and Low Temperature Environments |
| | High Temperature Interconnections Requirements |
| | The Use of Flip Chips in HTE |
| | General Overview of Metallurgical Interfaces for Both HTE and LTE |
| | Low Temperature Environment Interconnection Requirements |
| | Corrosion and Other Problems in Both , and 4.5. The Potential Use of High Temperature Polymers in HTE |
| | Design, Process, and Reliability of Wafer Level Packaging |
| | >>Link: Design, Process, and Reliability of Wafer Level Packaging\Design, Process, and Reliability of Wafer Level Packaging |
| | Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow |
| | >>Link: Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow\Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Probabilistic Physical Design of Fiber-Optic Structures |
| | >>Link: Physical Design\Physical Design\Probabilistic Physical Design of Fiber-Optic Structures |
| | Refraction and Reflection Losses |
| | Calculations for Coupling Losses |
| | Interactions in System and Identification of Critical Variables |
| | Function Variable Incidence Matrix |
| | Function Variable Incidence Matrix to Graph Conversion |
| | Graph Partitioning Techniques |
| | System Decomposition using Simulated Annealing |
| | Deterministic Design Procedures |
| | Optimal and Robust Design |
| | A Brief Review of Multi-Objective Optimization |
| | The First and Second Order Second Moment Methods |
| | Probabilistic Design for Maximum Reliability |
| | Stochastic Characterization of Epoxy Behavior |
| | Dynamic Mechanical Analysis |
| | Analytical Model to Determine VCSEL Displacement |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | The Wirebonded Interconnect: A Mainstay for Electronics |
| | >>Link: Physical Design\Physical Design\The Wirebonded Interconnect: A Mainstay for Electronics |
| | Integrated Circuit Revolution |
| | Thermocompression Bonding |
| | Bonding Automation and Optimization |
| | Higher Frequency Wirebonding |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow |
| | >>Link: Physical Design\Physical Design\Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow |
| | Design and Fabrication of Silicon Optical Bench with V-grooves |
| | Issues of Conventional Passive Alignment Methods |
| | V-grooves with Cover Plate |
| | Conclusions and Discussion |
| | Modified Passive Alignment Method |
| | Effects of Epoxy Viscosity and Dispensing Volume |
| | Application to Fiber Array Passive Alignment |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| | Design, Process, and Reliability of Wafer Level Packaging |
| | >>Link: Physical Design\Physical Design\Design, Process, and Reliability of Wafer Level Packaging |
| | Challenges of Wafer Level Underfill |
| | Examples of Wafer Level Underfill Process |
| | Comparison of Flip-Chip and WLCSP |
| | Wafer Level Test and Burn-In |
| | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging |
| |